Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

A new technical paper titled “Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

Exploiting CPU Cache Side-Channels to Leak Tokens from Large Language Models” was published by researchers at MITRE and Worcester Polytechnic Institute. Abstract “Side-channel attacks on shared ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chip smuggling prevention; AI export controls and deals; OSAT revenue up; AI PC memory chipsets; big fundings and buybacks; ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

Just adding more or thicker wires to a design isn't sufficient with chiplets.

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...