A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

(Nanowerk News) Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a ...

3D micro-/nanofabrication holds the key to build a large variety of micro-/nanoscale materials, structures, devices, and systems with unique properties that do not manifest in their 2D planar ...